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Possible Answers:
DIE.
Last seen on: Thomas Joseph – King Feature Syndicate Crossword – Jan 7 2023
Random information on the term “Game cube”:
Hon Hai Precision Industry Co., Ltd., trading as Hon Hai Technology Group in China and Taiwan and Foxconn internationally, is a Taiwanese multinational electronics contract manufacturer established in 1974 with headquarters in Tucheng, New Taipei City, Taiwan. In 2021, the company’s annual revenue reached 5.99 trillion New Taiwan dollars (US$175 billion) and was ranked 20th in the 2022 Fortune Global 500. It is the world’s largest technology manufacturer and service provider. While headquartered in Taiwan, the company is the largest private employer in the People’s Republic of China and one of the largest employers worldwide. Terry Gou is the company founder and former chairman.
Foxconn manufactures electronic products for major American, Canadian, Chinese, Finnish, and Japanese companies. Notable products manufactured by Foxconn include the BlackBerry, iPad, iPhone, iPod, Kindle, all Nintendo gaming systems since the GameCube (except subsequent Nintendo DS models), Nokia devices, Sony devices (including the PlayStation 3 and PlayStation 4 gaming consoles), Google Pixel devices, Xiaomi devices, every successor to Microsoft’s first Xbox console, and several CPU sockets, including the TR4 CPU socket on some motherboards. As of 2012, Foxconn factories manufactured an estimated 40% of all consumer electronics sold worldwide.
Random information on the term “DIE”:
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies and die. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.
Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm.
These wafers are then polished to a mirror finish before going through photolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go through wafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are then packaged and the completed integrated circuit is ready to be shipped.