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Fade out

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Possible Answers:

DIE.

Last seen on: Thomas Joseph – King Feature Syndicate Crossword – Oct 13 2022

Random information on the term “Fade out”:

In audio engineering, a fade is a gradual increase or decrease in the level of an audio signal. The term can also be used for film cinematography or theatre lighting in much the same way (see fade (filmmaking) and fade (lighting)).

A recorded song may be gradually reduced to silence at its end (fade-out), or may gradually increase from silence at the beginning (fade-in). Fading-out can serve as a recording solution for pieces of music that contain no obvious ending. Both fades and cross-fades are very valuable since they allow the engineer to quickly and easily make sure that the beginning and the end of any audio is smooth, without any prominent glitches. It is necessary that there is a clear section of silence prior to the audio. Fade-ins and -outs can also be used to change the characteristics of a sound, such as to soften the attack in vocals where very plosive (‘b’, ‘d’, and ‘p’) sounds occur. It can also be used to soften up the attack of the drum and/or percussion instruments. A cross-fade can be manipulated through its rates and coefficients in order to create different styles of fading. Almost every fade is different; this means that the fade parameters must be adjusted according to the individual needs of the mix.

Fade out on Wikipedia

Random information on the term “DIE”:

A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies and die. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.

Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm.

These wafers are then polished to a mirror finish before going through photolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go through wafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are then packaged and the completed integrated circuit is ready to be shipped.

DIE on Wikipedia

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