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Possible Answers:
SEMI.
Last seen on: Daily Boston Globe Crossword Monday, March 6, 2023
Random information on the term “Big rig”:
A box truck—also known as a box van, cube van, bob truck or cube truck—is a chassis cab truck with an enclosed cuboid-shaped cargo area. On most box trucks, the cabin is separate to the cargo area; however some box trucks have a door between the cabin and the cargo area.
The difference between a box truck and a van is that the cargo van is a one-piece (unibody), while a box truck is created by adding a cargo box to a chassis cab.
Box trucks are typically 10–26 ft (3.0–7.9 m) in length and can range from Class 3 to Class 7 (12,500 lb. to 33,000 lb. gross vehicle weight rating). They often have a garage door-like rear door that rolls up. They are often used by companies transporting home appliances or furniture, or are used as moving trucks which can be rented by individuals.
Ford, Dodge and Chevrolet/GMC have historically been the most common manufacturers of conventional cab/chassis[citation needed] to which the cargo box is attached by various producers (called body builders or upfitters). Isuzu Motors, Mitsubishi Fuso Truck of America, Inc. and UD Trucks have been the most common producers of cab over-type medium duty cab/chassis used as platforms for box trucks.[citation needed]
Random information on the term “SEMI”:
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) “chips” such as computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and physico-chemical processing steps (such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or “fabs”, with the central part being the “clean room”. In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average. Production in advanced fabrication facilities is completely automated and carried out in a hermetically sealed nitrogen environment to improve yield (the percent of microchips that function correctly in a wafer), with automated material handling systems taking care of the transport of wafers from machine to machine. Wafers are transported inside FOUPs, special sealed plastic boxes. All machinery and FOUPs contain an internal nitrogen atmosphere. The insides of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment. Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen.